China’s decades-long effort to build semiconductor independence has dramatically intensified in response to U.S. export restrictions.
While the country’s chip ambitions date back to the 1950s, a major strategic shift occurred post-1978 economic reforms and gained structure with the Made in China 2025 initiative, targeting 70 percent self-sufficiency in semiconductor production by 2025—a goal still in reach despite challenges. As of 2024, China commands one-third of global semiconductor capital expenditure, up 28 percent year-on-year and nearly five times 2012 levels. Firms like HiSilicon and SMIC have made headway, but face bottlenecks in producing cutting-edge chips due to reliance on Western lithography tools and advanced AI chip architectures.
Key Highlights
In response, China is shifting focus to sectors where mid-range chip capabilities suffice, such as robotics. A Suzhou-based robotics firm reports 90% component independence—signaling strategic adaptation. Additionally, China is expected to launch a new $40 billion state-backed semiconductor fund, aiming to reduce reliance on US technology and potentially spark global chip price wars.
Also Read: Malaysia to Strengthen Semiconductor Rules Amid US Pressure
This effort is supported by China’s aggressive downstream control of critical minerals and expansion in digital infrastructure, aligning with its next-generation industrial revolution strategy. However, the tech bifurcation comes with geopolitical friction. U.S.-China trade, once tightly integrated, is now becoming a battlefield of leverage—most notably through rare earth mineral controls and semiconductor bans.
Paradoxically, U.S. sanctions are accelerating China’s domestic innovation and creating a parallel tech ecosystem that may reshape global supply chains for decades to come.
We use cookies to ensure you get the best experience on our website. Read more...