Huawei to Reveal Breakthrough in AI Memory Tech

Huawei Technologies is preparing to announce a technological breakthrough aimed at reducing China’s dependence on high-bandwidth memory (HBM) chips for AI reasoning, according to state-run Securities Times.

The official unveiling is scheduled for August 12, 2025, at the Financial AI Reasoning Application Landing and Development Forum in Shanghai, co-hosted with China UnionPay. HBM chips are critical for AI applications, enabling faster data processing and higher efficiency in machine learning tasks. However, the market for advanced HBM products is currently dominated by US-based Micron Technology and Advanced Micro Devices (AMD), along with South Korean giants Samsung Electronics and SK Hynix.

Key Highlights

• Huawei to reveal AI storage reasoning acceleration tech on Aug 12
• Breakthrough could reduce China’s reliance on US/South Korean HBM chips
• Announcement comes amid US export bans on advanced chip technology

In 2024, the Biden administration imposed an export ban on advanced HBM chips to China, part of a broader strategy to restrict China’s semiconductor advancements. This move intensified China’s push for self-reliance in advanced chip technology.

Also Read: Huawei's AI Chip Strategy Tests US Tech Dominance Abroad

Huawei’s upcoming announcement will reportedly focus on “AI storage reasoning acceleration”, a potential alternative that could bypass the need for imported HBM chips in certain AI workloads. While the company has not disclosed technical specifications, the development could mark a significant step in China’s AI hardware independence.