Smartkem Signs JDA with Manz Asia for Next-Gen Dielectric Ink Tech

Semiconductor materials leader Smartkem has signed a preliminary Joint Development Agreement (JDA) with Manz Asia to co-develop next-generation dielectric ink solutions for next-gen chip packaging. The alliance is specifically aimed at AI applications and positioning itself to alleviate bottlenecks in high-performance computing through innovations in wafer-level and panel-level packaging.

Ian Jenks, Chairman and CEO of Smartkem said, “This collaborative development agreement follows our work with Manz Asia, which has already seen us debut our first demonstration at SEMICON SEA 2025 of a high-end inkjet metallization process. Working together, we believe we can develop scalable, high-performance solutions that can save cost and increase yield—area needs for data centers deploying AI accelerators at scale.”

Key Highlights-

• Smartkem and Manz Asia to co-develop advanced dielectric inks for AI chip packaging
• Partnership targets scalable wafer and panel-level semiconductor solutions
• JDA aims to boost yield and cut costs in next-gen AI accelerator production

The JDA will draw on Smartkem's proprietary semiconductor materials and Manz Asia's precision engineering expertise in semiconductor manufacturing equipment. Emphasis is on facilitating scalable production of 12 wafer-level and large-area panel packaging, a critical step toward chipmakers scaling beyond conventional wafer limitations.

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Robert Lin, General Manager of Manz Asia, added, "Through the union of Smartkem's material science capabilities and our engineering prowess, we believe this JDA will accelerate industrial uptake of dielectric ink technology. These materials are imperative in back-end-of-line processes, enabling high-resolution patterning and sophisticated interconnect structures."

Though the deal is now non-binding, the two firms view it as a stepping stone for transforming chip packaging, especially for AI-based markets. The action follows increasing industry demands for enhanced performance, thermal efficiency, and affordable semiconductor production.