TSMC to Build 4 New Fabs for 2nm & 1.4nm Chips by 2028

Taiwan Semiconductor Manufacturing Co (TSMC) is set to significantly expand its chipmaking capacity with the construction of four new advanced semiconductor plants under its Fab 25 project in the Central Taiwan Science Park.

Construction is scheduled to begin later this year, as announced by Hsu Maw-shin, director-general of the park bureau. These state-of-the-art facilities will focus on the production of 2-nanometer and 1.4-nanometer chips, marking a major milestone in TSMC’s next-generation technology roadmap.

Key Highlights

• TSMC to construct 4 new plants under Fab 25 in Central Taiwan
• Targeting 2nm and 1.4nm chip production by late 2028
• Projected monthly output: 50,000 advanced semiconductor wafers

The first of the four plants will complete its risk assessments by 2027, with mass production expected to commence by late 2028. Once fully operational, the facilities will have a target monthly capacity of 50,000 wafers, placing them among the most advanced semiconductor fabs globally.

The move is in line with TSMC’s ongoing efforts to maintain its global leadership in chip manufacturing amidst rising competition from players in the US, South Korea, and China.

The Fab 25 project also reinforces Taiwan’s position as a vital hub in the global semiconductor supply chain.

Also Read: TSMC Announces $100 Billion US Investment to Build Five New Chip Factories

By investing in such high-tech capacity, TSMC aims to meet the growing demand for smaller, faster, and more energy-efficient chips that power everything from smartphones to AI systems.