JSR Corporation, a world leader in materials innovation and parent company to Inpria Corporation, has signed a non-exclusive cross-licensing and joint development agreement with Lam Research Corporation, a worldwide semiconductor manufacturing equipment provider, to promote the industry's transition to next-generation patterning and dry resist technologies for EUV (extreme ultraviolet) lithography.
The collaboration takes advantage of JSR/Inpria's leading-edge metal oxide photoresists and Lam's deposition, etch, and EUV patterning technology, including its Aether dry resist technology, a significant innovation intended to streamline and lower the cost of chip fabrication for AI and high-performance computing (HPC).
"By uniting JSR and Inpria's material know-how with Lam's expertise in deposition, etch, and dry resist technologies, we're positioning ourselves to drive solutions for EUV lithography – high NA included – and enable the industry to scale effectively for the new AI era," stated Toru Kimura, Senior Officer, JSR Corporation.
Key highlights:
Under the pact, the two firms will collaboratively develop and integrate sophisticated patterning materials and etch processes, focusing on innovation in metal oxide resists, high NA EUV, and atomic layer deposition. JSR's recent acquisition of Yamanaka Hutech Corporation will also be used to research new precursors and process innovation.
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"This partnership allows us to speed innovation during a period of increasing semiconductor complexity. We look forward to making Aether more accessible and pushing forward next-generation EUV solutions." stated Vahid Vahedi, Chief Technology and Sustainability Officer, Lam Research.
The deal puts both firms in position to address chipmakers' scaling demands in the face of the needs of the AI era.
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