TSMC to Build 1.4nm Chip Fab in Taichung, Launch by 2028

Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest contract chipmaker, is set to begin construction of its new 1.4-nanometer chip fabrication plant in Taichung, Taiwan, in the next quarter.

The announcement was made by the Central Taiwan Science Park Bureau, which confirmed that the facility represents one of the most advanced semiconductor projects globally.

Production at the new fab is expected to commence in 2028, utilizing TSMC’s cutting-edge 1.4nm process technology, which will deliver higher performance and energy efficiency to meet the rapidly growing demands of AI computing, high-performance computing (HPC), and advanced consumer electronics.

Key Highlights

TSMC to start building 1.4nm chip fab in Taichung next quarter
Fab to begin production in 2028 with US$16.5B projected output
Project will create around 4,500 new jobs in Taiwan

The project’s estimated production value has been revised upwards to NT$500 billion (US$16.5 billion), surpassing earlier forecasts, and highlighting its importance to Taiwan’s semiconductor supply chain. Beyond technological advancements, the new fab is also expected to generate significant economic benefits, creating around 4,500 new jobs in the Taichung region.

Also Read: TSMC to Build 4 New Fabs for 2nm & 1.4nm Chips by 2028

This expansion further strengthens Taiwan’s leadership in the global semiconductor industry, especially at a time when demand for advanced nodes is surging amid digital transformation and the AI boom. With this strategic investment, TSMC reinforces its commitment to maintaining its dominance in the next generation of chip manufacturing.